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How On-Site Clean Rooms Set Technetics Apart

How On-Site Clean Rooms Set Technetics Apart

Released Thursday, 12th November 2020
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How On-Site Clean Rooms Set Technetics Apart

How On-Site Clean Rooms Set Technetics Apart

How On-Site Clean Rooms Set Technetics Apart

How On-Site Clean Rooms Set Technetics Apart

Thursday, 12th November 2020
Good episode? Give it some love!
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Often, in manufacturing, being almost to standard would be a disaster. Products must be built just right, with the consequences of falling short sometimes the difference between the success or failure of a product.
 
Andrew Bastion, Technetics Group’s Director of Product Management and Strategy, and his team know things must be done almost perfectly. Luckily, they are able to use on-site clean rooms to make sure contaminates aren’t introduced in the process.
 
Having a trio of clean rooms, two rated Class 8 and one Class 5, on-site means that, unlike many of its competitors, Technetics doesn’t have to ship products off to a facility elsewhere. Many other companies are moving products long ways to places like Florida or California.
 
“I don’t know of any that have an on-site Class 5 clean room,” Bastian said. “I believe that we’re the only one, and that’s the reason that we’ve done very well in this. If you need a product that is clean and need it fast, we have to be one of the best options, because everyone else is shipping them back and forth across the country.”
 
The process saves a minimum of three days but often saves even more time if normal shipping is used rather than overnight. Technetics’ advantage in the area is clear. That’s great news for a number of companies in industries, but particularly in the semiconductor and medical device industries, which need mission-critical PTFE that stands up to the rigors of their applications.
 
“The two major industries where we’re seeing this used are semiconductor and medical device. Semiconductor is definitely the largest by volume. They used PTFE in their wet chemical processes and any debris or FOD, foreign-object debris, in the process is a potential contaminate on a wafer,” Bastion said.

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